
NXP Semiconductors
Low capacitance double ESD protection
diode
PACKAGE OUTLINE
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
Product data sheet
PESDxL2UM series
SOT883
b
2
L
L1
e
3
b1
1
e1
A
A1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A (1)
0.50
0.46
A 1
max.
0.03
b
0.20
0.12
b 1
0.55
0.47
D
0.62
0.55
E
1.02
0.95
e
0.35
e 1
0.65
L
0.30
0.22
L 1
0.30
0.22
Note
1. Including plating thickness
OUTLINE
VERSION
SOT883
IEC
REFERENCES
JEDEC JEITA
SC-101
EUROPEAN
PROJECTION
ISSUE DATE
03-02-05
03-04-03
2005 May 23
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